|Nominal thickness||IEC 60394-2||mm||0.24 ± 0.04|
|Total substance||IEC 60394-2||g/m²||360 ± 35|
|Tensile strength||IEC 60394-2||N/cm||≥80|
EGSB ® 2709 T
EGSB ® 2709 T consists of polyester-fabric, impregnated with a silicon carbide resin mixture in B-stage. EGSB ® 2709 T is a flexible semi cured tape with a defined resistance characteristic, depending on the voltage due to the silicon carbide. The improved adhesive properties guarantee a complete sealing between the layers of EGSB ® 2709 T. EGSB ® 2709 T has got a slightly tackier surface then conventional EGSB ® 2709 T. The final properties are achieved when the tape has been cured and the layers bond together.
EGSB ® 2709 T is used for insulating systems in VPI technology as voltage stress grading at the overhang part of coils and bars of high voltage machines. The performance of EGSB ® 2709 T is highly increased by using ISOSEAL ® MF 0611 (MF ME 2400) for VPI system. Sealing with SIOSEAL ® MF 611 (MF ME 2411) is recommended.
Minimum 6 months at 20 °C
Optimum curing Conditions: 2 hours at 160 °C
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